This paper is published in Volume-4, Issue-2, 2018
Area
Materials
Author
Darren D'cruz, Avinash. T, Dr. K. Arun Vasantha Geethan
Org/Univ
St. Joseph's Institute of Technology, Chennai, Tamil Nadu, India
Pub. Date
10 April, 2018
Paper ID
V4I2-1656
Publisher
Keywords
Soldering, Pollution, Composite Mixture, Pastry range, Ductile nature, Wetability.

Citationsacebook

IEEE
Darren D'cruz, Avinash. T, Dr. K. Arun Vasantha Geethan. Development and characterization of lead-free solders, International Journal of Advance Research, Ideas and Innovations in Technology, www.IJARIIT.com.

APA
Darren D'cruz, Avinash. T, Dr. K. Arun Vasantha Geethan (2018). Development and characterization of lead-free solders. International Journal of Advance Research, Ideas and Innovations in Technology, 4(2) www.IJARIIT.com.

MLA
Darren D'cruz, Avinash. T, Dr. K. Arun Vasantha Geethan. "Development and characterization of lead-free solders." International Journal of Advance Research, Ideas and Innovations in Technology 4.2 (2018). www.IJARIIT.com.

Abstract

The paper describes the replacement of Lead with a composite mixture – Al, Zn, Sn, In in the process of soldering to eliminate the null effects on the environment like soil pollution and air pollution. The Breaching of lead during the conventional soldering process causes the above effects. This has prompted the development of “Pb - free” soldiers with desired attributes of an optimum melting point, wettability, Pasty range, Reduced Intermetallic layer and Ductile Nature. A number of tests have been conducted over the newly developed composite mixture, revealing reduced environmental effects when replaced with Lead without affecting the nature of the Process.