This paper is published in Volume-5, Issue-1, 2019
Area
Heat Transfer
Author
Sumeet Patil
Co-authors
A. N. Nayak, Dr. D. G. Kumbhar
Org/Univ
Bharati Vidyapeeth University College of Engineering, Pune, Maharashtra, India
Pub. Date
30 January, 2019
Paper ID
V5I1-1181
Publisher
Keywords
Heat transfer, CFD, Numerical analysis, Almond dimple

Citationsacebook

IEEE
Sumeet Patil, A. N. Nayak, Dr. D. G. Kumbhar. Numerical analysis of heat transfer using almond dimple in rectangular duct, International Journal of Advance Research, Ideas and Innovations in Technology, www.IJARIIT.com.

APA
Sumeet Patil, A. N. Nayak, Dr. D. G. Kumbhar (2019). Numerical analysis of heat transfer using almond dimple in rectangular duct. International Journal of Advance Research, Ideas and Innovations in Technology, 5(1) www.IJARIIT.com.

MLA
Sumeet Patil, A. N. Nayak, Dr. D. G. Kumbhar. "Numerical analysis of heat transfer using almond dimple in rectangular duct." International Journal of Advance Research, Ideas and Innovations in Technology 5.1 (2019). www.IJARIIT.com.

Abstract

Great importance has been given to developing a device and conducting a numerical analysis to define the situations in which an effective technique will improve heat transfer. Heat transfer technology is widely used in heat exchange applications such as refrigerators, automobiles, process industries, etc. Enhanced heat transfer study is also referred to heat transfer enhancement, augmentation, and intensification. The thought process of saving energy as a raw material has led to efforts to build more efficient heat exchange equipment. Standard heat transfer techniques such as active, passive and composite are also discussed in this paper. Improving heat transfer is one of the most important in almost every industry. Therefore, a very efficient heat transfer solution is needed not only to improve heat transfer but also to minimize the maximum flow resistance. In recent years, the idea of using dimpled surfaces on production devices has attracted a lot of attention because of the combination of improved heat transfer and loss of low-pressure loss. This paper presents a review of a numerical analysis of heat transfer using the almond dimple in the rectangular duct.